A polymer compound containing an epoxy group in a molecular structure is collectively referred to as an epoxy resin. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small set shrinkage, good dimensional stability and high hardness. It has good flexibility and is stable to alkali and most solvents. It is widely used in various departments of national defense and national economy for casting, dipping, laminating, bonding, coating and other purposes.
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